Anagram & Information om | Engelska ordet VIAS

Exempel på hur du använder VIAS i en mening

• Plated-through holes are no longer required with SMT boards for making the component connections, but are still used for making interconnections between the layers and in this role are more usually called vias.
• It was developed for microelectromechanical systems (MEMS), which require these features, but is also used to excavate trenches for high-density capacitors for DRAM and more recently for creating through-silicon vias (TSVs) in advanced 3D wafer level packaging technology.
• High-density multilayer PCBs may have microvias: blind vias are exposed only on one side of the board, while buried vias connect internal layers without being exposed on either surface.
• Variants of channel routing have also been shown to be NP-complete, as well as routing which reduces crosstalk, number of vias, and so on.
• 5D interposer is a 3D WLP that interconnects dies side-by-side on a silicon, glass, or organic interposer using through silicon vias (TSVs) and an RDL.
• Because the vertical walls of the SIW are not continuous, radiation leakages may flow between the vias.
• In "De longas vias, mui longas mentiras", the only cantiga de escárnio that he wrote, he mentions many Castilian place names.
• As such, the church of Saint Lucy which was built nearby is variously called in Septisolio, in Septizonium (both of which refer to the Septizodium), in septem solium, de septum solis, de sedes solis (referring to the "seven suns"), or even de septem viae or in septem vias (meaning, "at the seven ways").
• In July 2022, Samsung made a number of disclosures regarding the company's previously forthcoming process technology called "2GAP" (2nm Gate All-around Production): the process previously remained on track for 2025 launch into mass production; number of nanosheets was projected to increase from 3 in "3GAP" to 4; the company worked on several improvements of metallization, namely "single-grain metal" for low-resistance vias and direct-etched metal interconnect planned for 2GAP and beyond.

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